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Fluoroboric acid or tetrafluoroboric acid (and archaically, fluoboric acid) is an inorganic compound with the chemical formula H3OBF4.It is mainly produced as a precursor to other fluoroborate salts. It is a strong acid. Fluoroboric acid is corrosive and attacks the skin. It is available commercially as a solution in water and other solvents such as diethyl ether. It is a strong acid with a weakly coordinating, non-oxidizing conjugate base. It is structurally similar to perchloric acid, but lacks the hazards associated with oxidants.
Applications
Fluoroboric acid is the principal precursor to fluoroborate salts, which are typically prepared by treating the metal oxides with fluoroboric acid. The inorganic salts are intermediates in the manufacture of flame-retardant materials and glazing frits, and in electrolytic generation of boron. HBF4 is also used in aluminum etching and acid pickling.
Organic chemistry|
HBF4 is used as a catalyst for alkylations and polymerizations. In carbohydrate protection reactions, ethereal fluoroboric acid is an efficient and cost-effective catalyst for transacetalation and isopropylidenation reactions.
Galvanic cells
Aqueous HBF4 is used as an electrolyte in galvanic cell oxygen sensor systems, which consist of an anode, cathode, and oxygen-permeable membrane. The solution of HBF4 is able to dissolve lead(II) oxide from the anode in the form of lead tetrafluoroborate while leaving the rest of the system unchanged.
Metal plating
A mixture of CrO3, HBF4, and sulfonic acids in conjunction with a cathode treatment give tin-plated steel. Tin(I) fluoroborate/fluoroboric acid mixtures and organic reagents are used as the electrolyte in the cathode treatment of the tin plating process. Similar processes of electrodeposition and electrolytic stripping are used to obtain specific metal alloys.
A 10% solution of fluoroboric acid, tin fluoroborate and thiourea is used to immersion tin plate the copper traces of printed circuit boards for protection and easier soldering. This is not to be confused with electroless plating of the traces as the solution, commercially sold as Liquid Tin, does not contain the chemicals required to reduce tin (II) tetrafluoroborate to metallic tin. Rather, this chemical relies on the low pH created by the fluoroboric acid to increase the reduction potential of tin vs copper to the point to where tin preferentially plates on the copper traces.
